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Although
going to the beach is usually a good idea to beat the heat,
electronic components find themselves in a different predicament. As
processor speeds and board populations increase, chassis and fan
sizes are on the decline. Many items which once had cooling fans, are
now designed without. As a result, heat sink use is on the rise and
for good reason. Use of heat sinks are an effective way to dissipate
heat by increasing surface cooling areas.
However,
problems may still arise when heat sinks are used on irregularly
sized components. Gaps between them may allow excessive heat to
accumulate This is where Bergquist's Gap Pad VO(tm)
shines.
Gap
Pad is a thermally conductive interface material, designed to fill
the air gaps between hot devices and their heat spreaders. Gap pad is
a highly conformable, low modulus polymer, which is available in a
range of thicknesses from 0.020" to 0.160". Gap Pad is also
available with or without adhesive. As always, Orion can provide Gap
Pad in custom sizes or die cut shapes, to precisely fit your
requirements. For additional information see our website, or contact
our sales department. Samples of this, and other thermal interface
materials are immediately available upon request.
Gap
Pad provides an effective thermal interface between heat sinks and
electronic devices where uneven surface topography, air gaps and
rough surface textures are present. Gap Pad provides:
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Elimination of air gaps to reduce
thermal resistance
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High conformability to reduce
interfacial resisitance
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Low-stress vibration dampening
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Compatible with automated dispensing
equipment
As
always, all of these materials are available as die cut parts, either
as custom products or in standard configurations. Please contact your
ORION sales representative for additional information on Gap-Pad, and
for a list of standard configurations.
For
additional information on these products see http://www.bergquistcompany.com/tm_sil_pad_list.cfm
Sil-Pad
and Poly-Pads are registered trademarks of The Bergquist Company.
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